According to a report titled ‘Electronic Thermal Management Materials Market Size By Product (Conductive Pastes [Silicone, Epoxy, Acrylic], Conductive Tapes, Phase Change Materials [Paraffin, Salt Hydrates], Gap Fillers [Silicone, Non-silicone], Thermal Greases [Silicone, Non-silicone]), By End-user (Consumer Electronics, Automotive, Aerospace, Healthcare, Telecom), Industry Analysis Report, Regional Outlook (U.S., Canada, Germany, UK, France, Spain, Italy, Russia, China, India, Japan, Taiwan, South Korea, Malaysia, Brazil, Mexico, Saudi Arabia, South Africa, UAE), Application Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 - 2025’, available with Market Report Study LLC, the global electronic thermal management materials market is expected to cross USD 3 billion by the year 2025.
 

Thermal management materials have become a crucial part of consumer electronics. These materials improve the reliability and functionality of the electronic devices. Modern consumer electronics draw more power and dissipate more heat. In order to keep the heat threshold in check, thermal management materials are being used in electronic devices. They enable better conduction and dissipation of heat within the electronic assembly. Increasing innovations in consumer electronics, coupled with the rising application of thermal management materials in healthcare, automotive, and aerospace sectors are driving the growth of electronic thermal management materials market.
 

Growing adoption of electric & hybrid cars will also provide lucrative growth opportunities in the coming years. However, volatile prices of the raw materials, along with strict norms regarding the use of polymer based thermal products will hinder the growth of electronic thermal management materials market over the forecast timeline.  
 

Based on the product scope, the industry is segmented into thermal greases, gap fillers, phase change materials, conductive tapes, and conductive pastes. Gap filler segment is expected grow at a constant pace during the forecast period. These products are generally used in heat sink assemblies for proper heat transfer. Extensive application in wireless infrastructure, VOIP phones, routers, controllers, microwave radio, and consumer electronics is fueling the demand for gap fillers.
 

On the other hand, phase change materials segment is anticipated to grow steadily during 2019-2025, owing to its ample use in consumer electronics and automotive applications. Paraffin based phase change materials possesses properties such as high fusion heat, hence are used in the automotive industry.
 

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Speaking of the topographical outlook, Asia Pacific held the majority revenue share of electronic thermal management materials market in 2018 and will continue this trend over the forecast period. Increasing individual spending on consumer electronics, along with the growing demand from telecom sector are stimulating the market scenario across Asia Pacific.
 

The key players of electronic thermal management materials market are 3M, Parker Chomerics, Darcoid Company, European Thermodynamics Ltd., Henkel AG & Company, Laird PLC, Honeywell International, Inc., Lord Corporation, Boyd, Amerasia International (AI) Technology, Inc., Marian, Inc., DuPont, Dr Dietrich Muller GmbH, and Wacker AG.