According to the recent research report titled ‘Hermetic Packaging Market Size By Configuration (Multi-layer Ceramic, Pressed Ceramic, Metal Can), By Product (Ceramic-Metal, Glass-Metal, Passivation Glass, Transponder Glass, Reed Glass), By Application (Sensors, Lasers, Transistors, MEMS (Microelectromechanical) Switches, Airbag Initiators, Photodiodes),By Industry (Military & Defense, Aerospace, Automotive, Medical, Telecommunication), Industry Analysis Report, Regional Outlook, Application Growth Potential, Price Trends, Competitive Market Share & Forecast, 2019 – 2026’, available with Market Study Report, global hermetic packaging market is projected to accrue a valuation of USD 6 billion by the year 2026.
 

Global hermetic packaging market growth is primarily driven by increasing sales of automotive, and surging demand for commercial aircrafts. Besides, development in sectors such as military & defense, healthcare, and electronics is adding to the industry progression.
 

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Rising consumer spending on air travel, growing middle-class population, and evolving airline vertical have spurred the commercial aircrafts sales. For insurance, the air travel market ihttps://www.marketstudyreport.com/reports/hermetic-packaging-markets predicted to rise 2.5 times, and worldwide commercial jet fleet is expected to double in size, with traffic growth of over 4.5% by 2038. This positive prognosis for the commercial aircraft industry is likely to increase the usage of hermetic connectors in fuel system sensors and assure safety of sensitive electronics, thereby impelling the market share.
 

Speaking of restraints, availability of substitute technology, and strict standards for hermetic packaging are likely to hamper the industry expansion over the study period.
 

Elaborating on configuration gamut, pressed ceramic segment is predicted to bolster at 6% CAGR through 2026, attributable to its affordability as compared to multilayer ceramic packages. Meanwhile, reed glass segment is projected to amass USD 400 million by the end of the forecast period, due to its excellent wear resistance and high reliability.  
 

Based on application spectrum, global hermetic packaging market share from MEMS (microelectromechanical system) switches is expected to record 8% CAGR over 2019-2026. These switches are delicate, include moving parts, and create interference in environment, necessitating hermetic packaging.
 

As per industry vertical, medical segment is projected to register a compound annual growth rate of 7% over the next six years. Cardiac implants, pacemakers, UV lasers for surgical drilling, and defibrillators with high functionality can all benefit from efficient sealing offered by hermetic packing.
 

Geographically, North America market size is anticipated to expand through 2026, owing to rising healthcare sector and increasing expenditure for improved medical services in the U.S.
 

Prominent firms influencing global hermetic packaging market dynamics are Special Hermetic Products Inc., SGA Technologies Ltd., Renesas Electronics Corporation, Winchester Interconnect Corporation, Legacy Technologies Inc., Micross Components Inc., Willow Technologies Ltd., Egide Group, Kyocera Corporation, Materion Corporation, Amkor Technology Inc., Teledyne Technologies Inc., Texas Instruments Inc., Ametek Inc., and Schott AG.