According to the research report titled ‘Global Low Dielectric Materials Market Size study, By Type (Thermoplastic, Thermoset, Ceramics), By Application (PCBs, Antenna, Microelectronics, Wire & Cable, Radome, Others), and Regional Forecasts 2022-2028’ available with MarketStudyReport, global low dielectric materials market is expected to register considerable growth through 2028.

The rising development of 5G communication, the growing production of airplanes & automobiles, and the increasing number of strategic initiatives & product launches introduced by key players are the primary factors burgeoning the expansion of global low dielectric materials market.

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For the record, a low dielectric material is a non-conducting material that stores electrical charges or a non-metallic material with high specific resistance. It has negative temperature coefficient of resistance, and large insulation resistance. This material is a good insulator with a low heat, electricity, or sound conductivity, and it is widely used in applications such as antennas, radomes, microelectronics, PCBs, wires & cables, and others.

Moreover, the surging demand for printed circuit board (PCB) in the telecommunication sector and the growing preference for environmentally friendly modified polyphenylene ether (m-PPE) resin are anticipated to act as catalyzing factors for demand in the industry during the forecast period.

However, high processing and manufacturing costs, as well as numerous problems associated with processing low dielectric resin, will impede market expansion during 2022-2028.

Worldwide low dielectric materials market is segmented in terms of type, and application spectrum to provide a deeper understanding of the revenue potential. Based on type, the market is classified into ceramics, thermostats, and thermoplastic. Moving on to the application spectrum, the industry is categorized into microelectronics, PCBs, antenna, wire & cable, radome, and others.

Geographically, the market spans across Asia Pacific, North America, Europe, Latin America, and the rest of the world. Among these, North America market is anticipated to exhibit a significant growth rate over the forecast period, attributed to the rising emphasis placed on developing a strong communication network, and the presence of well-established players across the region.

While Asia Pacific low dielectric materials industry is predicted to expand substantially during the study period, owing to the growing use of electronic components such as PCBs & microelectronics, and the increasing air traffic that is fueling the demand for antennae and radomes.

The prominent companies operating in the market are Mitsubishi Corporation, DIC Corporation, Zeon Corporation, Topas Advanced Polymers, Asahi Kasei Corporation, Chemours Company LLC, Showa Denko, Saudi Basic Industries Corporation, Solvay S.A., and Huntsman Corporation.