As per the research report titled ‘North America Hermetic Packaging Market Forecast 2027 By Product, By Configuration, By Application Switches, Transistors, Sensors), By Sector, Research Report, COVID-19 Impact Statistics, Country Outlook, Price Trends, Historic Data, Growth Prospects, Competitive Industry Share’, available with MarketStudyReport, North America hermetic packaging market is anticipated to amass a valuation of USD 2.2 billion by 2027.

Escalating demand for electronic packaging devices as well as increasing product utilization across various end-use verticals such as defense, aviation, consumer electronics, energy & nuclear safety, and automotive electronics are the major factors propelling North America hermetic packaging market growth.

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Further, increasing government focus on research & development, in congruence with technological innovation in the field are likely to unearth new opportunities for market expansion in the forthcoming years,

For the purpose of a comprehensive assessment, North America hermetic packaging industry is segregated on the basis of product type, sector, configuration, application spectrum, and regional terrain.

Considering product type, glass metal sealing segment held 40% industry share in the recent past, mainly attributable to its superior insulating capabilities and the ability to resist heat which makes it a preferred choice for packaging across various end-use verticals such as medical, aerospace, sensors, and automobiles.

Meanwhile, the ceramic metal sealing segment is expected to progress at a CAGR of 9% through the forecast period, creditable to superior mechanical strength and thermal capabilities, making it an indispensable part of aircraft engines, gas turbine engine thermocouples, fire detection systems, and implantable electronic devices among others.

Speaking of industrial sector, the military & defense segment generated USD 540 million in 2020 and is likely to grow at a robust pace through 2027, as degree of accidents & injuries is high, wherein hermetic packaging becomes elemental for creating a strong military base.

The competitive framework of North America hermetic packaging business sphere is defined by key players such as Renesas Electronic Corporation, Winchester Interconnect, Legacy Technologies GmbH, Micross Components Inc., Special Hermetic Products Inc., Egide Group, Kyocera Corporation, Materion Corporation, Amkor Technology Inc., Teledyne Technologies Inc., Texas Instruments Inc., AMETEK Inc., and Schott AG.