According to the research report titled ‘North America Hermetic Packaging Market Forecast 2027 By Product, By Configuration, By Application Switches, Transistors, Sensors), By Sector, Research Report, COVID-19 Impact Statistics, Country Outlook, Price Trends, Historic Data, Growth Prospects, Competitive Industry Share’, available with MarketStudyReport, North America hermetic packaging market is anticipated to amass a valuation of USD 2.2 billion by the year 2027.
 

Ever-rising demand for sensitive electronics, in consort with ongoing R&D activities, and increasing incorporation of electronic packaging are the major growth determinants for North America hermetic packaging market growth.

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Moreover, with a wide range of applications in automotive electronics, sensors, consumer electronics, energy & nuclear safety, as well as defense, aviation, and space electronics, the industry is expected to grow tremendously over the forecast period.

Notably, the Covid-19 outbreak has significantly raised the demand for medical equipment worldwide, which is aiding usage of hermetic packaging, thereby propelling the industry trends.

Based on configuration, the industry is divided into metal can, pressed ceramic, and multi-layer ceramic. Speaking of application ambit, the marketplace is branched into airbag ignitors, photodiodes, laser, MEMS switch, sensors, transistors, and others.

In terms of product terrain of North America hermetic packaging market, the glass-metal sealing segment held 40% demand share in the recent past and is poised to grow significantly, due to its superior insulating and heat resistance abilities, which allows product usage in a wide array of high-end applications.

Additionally, ceramic metal sealing segment is poised to grow at 9% CAGR through 2027, on account of mechanical & thermal advantages of the product, and extensive usage in implantable electronic devices, aircraft engines, gas turbine engine thermocouples, fire detection system terminations, and seals for fuel line assemblies.

On the basis of sector, the military & defense segment accounted for USD 540 million in 2020 and is anticipated to grow significantly during the forecast period, owing to numerous accidents leading to demand for robust packaging, favorable government initiatives, and growing R&D activities.

Regionally, the U.S. industry is slated to record a notable growth over 2021-2027, owing to flourishing semiconductor manufacturing sector, and ongoing R&D efforts.

The key players in North America hermetic packaging marketplace are Special Hermetic Products, Inc., Renesas Electronics Corporation, Winchester Interconnect Corp., Legacy Technologies, Inc., Micross Components, Inc., Egide Group, Kyocera Corporation, Materion Corp., Amkor Technology, Inc., Teledyne Technologies Incorporated, Texas Instruments Incorporated, AMETEK, Inc., and Schott AG.