According to the research report titled ‘Thin Wafer Market Size, By Thickness (>200??? 1/4 m, 100??? 1/4 m - 199??? 1/4 m, 50??? 1/4 m - 99??? 1/4 m, 30??? 1/4 m - 49??? 1/4 m, 10??? 1/4 m - 29??? 1/4 m, <10??? 1/4 m), By Wafer Size (100 mm, 125 mm, 200 mm, 300 mm), By Process (Temporary Bonding & Debonding, {Ultra violate (UV)-release Adhesives, Thermal-release Adhesives, Solvent-release Adhesives}, Carrier-less Approach/Taiko Process), By Application (Micro-Electro-Mechanical Systems (MEMS), Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensors, Memory, Radio-Frequency (RF) Devices, Light-Emitting Diode (LED), Interposers, Logic), Industry Analysis Report, Regional Outlook, Growth Potential, Price Trends, Competitive Market Share & Forecast, 2021 – 2027’, available with MarketStudyReport, global thin wafer market is expected to register substantial growth by the year 2027.
 

Ongoing government initiatives, widespread adoption of MEMS in industrial as well as aerospace & defense applications, and growing demand for customized wafers are key factors driving the growth of global thin wafer market.

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For those unaware, a wafer is a thin piece of semiconductor silicon, which is in a disc-shape and is used for producing electric ICs and silicon-based photovoltaic cells. These wafers act as a substrate for various microelectronic circuits that also goes through numerous processes like doping, etching, and implantation before the end product process in completed.

In terms of thickness, the 30 μm-49 μm segment is predicted to expand at 14.5% compound annual growth rate between 2021 and 2027. This can be credited to its growing usage in electronic components including LEDs and diodes.

Moving on to wafer size, global thin wafer market share from 100 mm segment will record 5% CAGR through 2027, owing to growing demand for customized thin wafers to avoid break-down issues while production.

Based on application spectrum, the MEMS segment is anticipated to showcase a y-o-y growth rate of 9% during the forecast period, primarily driven by increasing utilization of MEMS in industrial as well as aerospace & defense applications for their high efficiency and compact size.

Considering the geographical landscape, LAMEA captured 4.5% market share in 2020 and is likely to witness notable growth during the study period. This can be attributed to surging investments to improve semiconductor manufacturing in the region.

The competitive landscape of global thin wafer market is defined by companies such as WaferPro LLC, Wafer World Inc., Virginia Semiconductor Inc., UniversityWafer Inc., SUMCO Corporation, Soitec, SK Siltron Co. Ltd., Siltronix Silicon Technologies, Siltronic AG, Silicon Valley Microelectronics Inc., Shin-Etsu Chemical Co. Ltd., Shanghai Simgui Technology Co. Ltd., Polishing Corporation of America, IceMOS Technology Ltd., and GlobalWafers Co. Ltd.