Research Summary
A chip package, also known as a semiconductor package or IC package, is a protective enclosure that houses a semiconductor chip or integrated circuit (IC) to protect it from external elements and provide electrical connections for interfacing with other components or circuitry. Chip packages play a crucial role in the semiconductor industry as they ensure the reliability, functionality, and thermal performance of the semiconductor devices. The package provides a secure environment for the delicate chip, shielding it from moisture, dust, and mechanical stress. It also facilitates the connection of the chip's electrical terminals to external circuits, allowing the IC to communicate and interact with other parts of the electronic system. Chip packages come in various forms and sizes, including leaded packages, ball grid arrays (BGAs), quad flat packages (QFPs), and flip-chip packages, each designed to meet specific requirements for different applications. The choice of chip package is determined by factors such as the chip's size, thermal considerations, electrical characteristics, and the intended use of the semiconductor device.
According to DIResearch's in-depth investigation and research, the global Chip Package market size will reach US$ Million in 2024, and is expected to reach US$ Million in 2030, with a CAGR of % (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ Million, accounting for approximately % of the world. It is expected to reach US$ Million in 2030, and the global share will reach %.
The major global manufacturers of Chip Package include ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS, Signetics, Carsem, King Yuan ELECTRONICS etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Chip Package. Focus on analysing the market share, product portfolio, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Chip Package market. The report data covers historical data from 2019 to 2023, base year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Chip Package market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Chip Package industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy.
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Chip Package Include:
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Chip Package Product Segment Include:
Traditional Packaging
Advanced Packaging
Chip Package Product Application Include:
Automotive and Traffic
Consumer Electronics
Communication
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Chip Package Industry PESTEL Analysis
Chapter 3: Global Chip Package Industry Porter's Five Forces Analysis
Chapter 4: Global Chip Package Major Regional Market Size and Forecast Analysis
Chapter 5: Global Chip Package Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Chip Package Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Chip Package Competitive Analysis of Key Manufacturers (Revenue, Market Share, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Revenue and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents 1 Chip Package Market Overview 1.1 Product Definition and Statistical Scope 1.2 Chip Package Product by Type 1.2.1 Global Chip Package Market Size by Type, 2023 VS 2024 VS 2030 1.2.2 Traditional Packaging 1.2.3 Advanced Packaging 1.3 Chip Package Product by Application 1.3.1 Global Chip Package Market Size by Application, 2023 VS 2024 VS 2030 1.3.2 Automotive and Traffic 1.3.3 Consumer Electronics 1.3.4 Communication 1.3.5 Other 1.4 Global Chip Package Market Revenue Analysis (2019-2030) 1.5 Chip Package Market Development Status and Trends 1.5.1 Chip Package Industry Development Status Analysis 1.5.2 Chip Package Industry Development Trends Analysis 2 Chip Package Market PESTEL Analysis 2.1 Political Factors Analysis 2.2 Economic Factors Analysis 2.3 Social Factors Analysis 2.4 Technological Factors Analysis 2.5 Environmental Factors Analysis 2.6 Legal Factors Analysis 3 Chip Package Market Porter's Five Forces Analysis 3.1 Competitive Rivalry 3.2 Threat of New Entrants 3.3 Bargaining Power of Suppliers 3.4 Bargaining Power of Buyers 3.5 Threat of Substitutes 4 Global Chip Package Market Analysis by Regions 4.1 Chip Package Overall Market: 2023 VS 2024 VS 2030 4.2 Global Chip Package Revenue and Forecast Analysis (2019-2030) 4.2.1 Global Chip Package Revenue and Market Share by Region (2019-2024) 4.2.2 Global Chip Package Revenue Forecast by Region (2025-2030) 5 Global Chip Package Market Size by Type and Application 5.1 Global Chip Package Market Size by Type 5.2 Global Chip Package Market Size by Application 6 North America 6.1 North America Chip Package Market Size and Growth Rate Analysis (2019-2030) 6.2 North America Key Manufacturers Analysis 6.3 North America Chip Package Market Size by Type 6.4 North America Chip Package Market Size by Application 6.5 North America Chip Package Market Size by Country 6.5.1 US 6.5.2 Canada 7 Europe 7.1 Europe Chip Package Market Size and Growth Rate Analysis (2019-2030) 7.2 Europe Key Manufacturers Analysis 7.3 Europe Chip Package Market Size by Type 7.4 Europe Chip Package Market Size by Application 7.5 Europe Chip Package Market Size by Country 7.5.1 Germany 7.5.2 France 7.5.3 United Kingdom 7.5.4 Italy 7.5.5 Spain 7.5.6 Benelux 8 China 8.1 China Chip Package Market Size and Growth Rate Analysis (2019-2030) 8.2 China Key Manufacturers Analysis 8.3 China Chip Package Market Size by Type 8.4 China Chip Package Market Size by Application 9 APAC (excl. China) 9.1 APAC (excl. China) Chip Package Market Size and Growth Rate Analysis (2019-2030) 9.2 APAC (excl. China) Key Manufacturers Analysis 9.3 APAC (excl. China) Chip Package Market Size by Type 9.4 APAC (excl. China) Chip Package Market Size by Application 9.5 APAC (excl. China) Chip Package Market Size by Country 9.5.1 Japan 9.5.2 South Korea 9.5.3 India 9.5.4 Australia 9.5.5 Indonesia 9.5.6 Vietnam 9.5.7 Malaysia 9.5.8 Thailand 10 Latin America 10.1 Latin America Chip Package Market Size and Growth Rate Analysis (2019-2030) 10.2 Latin America Key Manufacturers Analysis 10.3 Latin America Chip Package Market Size by Type 10.4 Latin America Chip Package Market Size by Application 10.5 Latin America Chip Package Market Size by Country 10.5.1 Mecixo 10.5.2 Brazil 11 Middle East & Africa 11.1 Middle East & Africa Chip Package Market Size and Growth Rate Analysis (2019-2030) 11.2 Middle East & Africa Key Manufacturers Analysis 11.3 Middle East & Africa Chip Package Market Size by Type 11.4 Middle East & Africa Chip Package Market Size by Application 11.5 Middle East & Africa Chip Package Market Size by Country 11.5.1 Saudi Arabia 11.5.2 South Africa 12 Market Competition by Manufacturers 12.1 Global Chip Package Market Revenue by Key Manufacturers (2020-2024) 12.2 Chip Package Competitive Landscape Analysis and Market Dynamic 12.2.1 Chip Package Competitive Landscape Analysis 12.2.2 Global Key Manufacturers Headquarter and Key Area Sales 12.2.3 Market Dynamic 13 Key Companies Analysis 13.1 ASE Group 13.1.1 ASE Group Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.1.2 ASE Group Chip Package Product Portfolio 13.1.3 ASE Group Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.2 Amkor Technology 13.2.1 Amkor Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.2.2 Amkor Technology Chip Package Product Portfolio 13.2.3 Amkor Technology Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.3 JCET 13.3.1 JCET Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.3.2 JCET Chip Package Product Portfolio 13.3.3 JCET Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.4 Siliconware Precision Industries 13.4.1 Siliconware Precision Industries Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.4.2 Siliconware Precision Industries Chip Package Product Portfolio 13.4.3 Siliconware Precision Industries Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.5 Powertech Technology 13.5.1 Powertech Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.5.2 Powertech Technology Chip Package Product Portfolio 13.5.3 Powertech Technology Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.6 TongFu Microelectronics 13.6.1 TongFu Microelectronics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.6.2 TongFu Microelectronics Chip Package Product Portfolio 13.6.3 TongFu Microelectronics Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.7 Tianshui Huatian Technology 13.7.1 Tianshui Huatian Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.7.2 Tianshui Huatian Technology Chip Package Product Portfolio 13.7.3 Tianshui Huatian Technology Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.8 UTAC 13.8.1 UTAC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.8.2 UTAC Chip Package Product Portfolio 13.8.3 UTAC Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.9 Chipbond Technology 13.9.1 Chipbond Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.9.2 Chipbond Technology Chip Package Product Portfolio 13.9.3 Chipbond Technology Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.10 Hana Micron 13.10.1 Hana Micron Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.10.2 Hana Micron Chip Package Product Portfolio 13.10.3 Hana Micron Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.11 OSE 13.11.1 OSE Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.11.2 OSE Chip Package Product Portfolio 13.11.3 OSE Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.12 Walton Advanced Engineering 13.12.1 Walton Advanced Engineering Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.12.2 Walton Advanced Engineering Chip Package Product Portfolio 13.12.3 Walton Advanced Engineering Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.13 NEPES 13.13.1 NEPES Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.13.2 NEPES Chip Package Product Portfolio 13.13.3 NEPES Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.14 Unisem 13.14.1 Unisem Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.14.2 Unisem Chip Package Product Portfolio 13.14.3 Unisem Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.15 ChipMOS 13.15.1 ChipMOS Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.15.2 ChipMOS Chip Package Product Portfolio 13.15.3 ChipMOS Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.16 Signetics 13.16.1 Signetics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.16.2 Signetics Chip Package Product Portfolio 13.16.3 Signetics Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.17 Carsem 13.17.1 Carsem Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.17.2 Carsem Chip Package Product Portfolio 13.17.3 Carsem Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 13.18 King Yuan ELECTRONICS 13.18.1 King Yuan ELECTRONICS Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.18.2 King Yuan ELECTRONICS Chip Package Product Portfolio 13.18.3 King Yuan ELECTRONICS Chip Package Market Data Analysis (Revenue, Gross Margin and Market Share) (2020-2024) 14 Industry Chain Analysis 14.1 Chip Package Industry Chain Analysis 14.2 Chip Package Industry Raw Material and Suppliers Analysis 14.2.1 Upstream Key Raw Material Supply Analysis 14.2.2 Raw Material Suppliers and Contact Information 14.3 Chip Package Typical Downstream Customers 14.4 Chip Package Sales Channel Analysis 15 Research Findings and Conclusion 16 Methodology and Data Source 16.1 Methodology/Research Approach 16.2 Research Scope 16.3 Benchmarks and Assumptions 16.4 Date Source 16.4.1 Primary Sources 16.4.2 Secondary Sources 16.5 Data Cross Validation 16.6 Disclaimer
Publisher: DIResearch
Related Reports
- Global Electrical Equipment Market (2024 Edition): Analysis By Product Type (Transmission and Distribution Equipment, Power Generation Equipment, Lighting Equipment, Wiring Devices and Electrical Accessories and Other Product Types), By End User, By Region, By Country: Market Insights and Forecast (2020-2030).
- Millimeter Wave Technology Market by License Type (Fully Licensed, Light Licensed, Unlicensed), Product, Component, Frequency Band, End User, and Geography - Global Industry Analysis, Opportunities and Forecast up to 2030
- Grow Lights Market by Installation Type (Retrofit Installations, New Installations), Light Source, Offering, Cultivated Plant, Spectrum, Sales Channel, Application, , and Geography - Global Industry Analysis, Opportunities and Forecast up to 2030
- Semiconductor & IC Packaging Materials Market by Type (Bonding Wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic Substrate, Solder Balls, Thermal Interface Materials, Underfill Materials), Packaging Technology, End User, and Geography - Global Industry Analysis, Opportunities and Forecast up to 2030
- 2024-2029 Global Electronic Packaging Materials Outlook Market Size, Share & Trends Analysis Report By Player, Type, Application and Region
Why Market Study Report?
- Best Price for Reports
- Large Report Database
- Easily Customize Reports
- 24/7 Email & Phone Support