Research Summary
IC (Integrated Circuit) advanced packaging equipment refers to specialized machinery used in the semiconductor manufacturing process to encapsulate and assemble integrated circuits in a compact and efficient manner. This equipment is crucial for the final stage of IC fabrication, where the semiconductor die is mounted and connected within a protective package. Advanced packaging techniques include technologies like 3D stacking, wafer-level packaging, and system-in-package (SiP) to enhance performance, miniaturize components, and improve energy efficiency. IC advanced packaging equipment involves processes such as die bonding, wire bonding, encapsulation, and testing. These technologies play a vital role in meeting the demands of modern electronic devices for increased functionality and reduced form factor, enabling the production of more powerful and compact integrated circuits used in a wide range of applications.
According to DIResearch's in-depth investigation and research, the global IC Advanced Packaging Equipment market size will reach US$ XX Million in 2024, and is expected to reach US$ XX Million in 2030, with a CAGR of XX% (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ XX Million, accounting for approximately XX% of the world. It is expected to reach US$ XX Million in 2030, and the global share will reach XX%.
The major global manufacturers of IC Advanced Packaging Equipment include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, Tokyo Seimitsu, BESI, Hitachi, Teradyne, Hanmi, Toray Engineering, Shinkawa, TOWA, COHU Semiconductor, SUSS Microtec etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of IC Advanced Packaging Equipment. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global IC Advanced Packaging Equipment market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the IC Advanced Packaging Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of IC Advanced Packaging Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy. ? ?
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of IC Advanced Packaging Equipment Include:
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
TOWA
COHU Semiconductor
SUSS Microtec
IC Advanced Packaging Equipment Product Segment Include:
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
IC Advanced Packaging Equipment Product Application Include:
Automotive Electronics
Consumer Electronics
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global IC Advanced Packaging Equipment Industry PESTEL Analysis
Chapter 3: Global IC Advanced Packaging Equipment Industry Porter's Five Forces Analysis
Chapter 4: Global IC Advanced Packaging Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global IC Advanced Packaging Equipment Market Size and Forecast by Type and Application Analysis
Chapter 6: North America IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa IC Advanced Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global IC Advanced Packaging Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents 1 IC Advanced Packaging Equipment Market Overview 1.1 Product Definition and Statistical Scope 1.2 IC Advanced Packaging Equipment Product by Type 1.2.1 Global IC Advanced Packaging Equipment Market Size by Type, 2023 VS 2024 VS 2030 1.2.2 Cutting Equipment 1.2.3 Solid Crystal Devices 1.2.4 Welding Equipment 1.2.5 Testing Equipment 1.2.6 Other 1.3 IC Advanced Packaging Equipment Product by Application 1.3.1 Global IC Advanced Packaging Equipment Market Size by Application, 2023 VS 2024 VS 2030 1.3.2 Automotive Electronics 1.3.3 Consumer Electronics 1.3.4 Other 1.4 Global IC Advanced Packaging Equipment Market Revenue and Sales Analysis 1.4.1 Global IC Advanced Packaging Equipment Market Size Analysis (2019-2030) 1.4.2 Global IC Advanced Packaging Equipment Market Sales Analysis (2019-2030) 1.4.3 Global IC Advanced Packaging Equipment Market Sales Price Trend Analysis (2019-2030) 1.5 IC Advanced Packaging Equipment Market Development Status and Trends 1.5.1 IC Advanced Packaging Equipment Industry Development Status Analysis 1.5.2 IC Advanced Packaging Equipment Industry Development Trends Analysis 2 IC Advanced Packaging Equipment Market PESTEL Analysis 2.1 Political Factors Analysis 2.2 Economic Factors Analysis 2.3 Social Factors Analysis 2.4 Technological Factors Analysis 2.5 Environmental Factors Analysis 2.6 Legal Factors Analysis 3 IC Advanced Packaging Equipment Market Porter's Five Forces Analysis 3.1 Competitive Rivalry 3.2 Threat of New Entrants 3.3 Bargaining Power of Suppliers 3.4 Bargaining Power of Buyers 3.5 Threat of Substitutes 4 Global IC Advanced Packaging Equipment Market Analysis by Regions 4.1 IC Advanced Packaging Equipment Overall Market: 2023 VS 2024 VS 2030 4.2 Global IC Advanced Packaging Equipment Revenue and Forecast Analysis (2019-2030) 4.2.1 Global IC Advanced Packaging Equipment Revenue and Market Share by Region (2019-2024) 4.2.2 Global IC Advanced Packaging Equipment Revenue Forecast by Region (2025-2030) 4.3 Global IC Advanced Packaging Equipment Sales and Forecast Analysis (2019-2030) 4.3.1 Global IC Advanced Packaging Equipment Sales and Market Share by Region (2019-2024) 4.3.2 Global IC Advanced Packaging Equipment Sales Forecast by Region (2025-2030) 4.4 Global IC Advanced Packaging Equipment Sales Price Trend Analysis (2019-2030) 5 Global IC Advanced Packaging Equipment Market Size by Type and Application 5.1 Global IC Advanced Packaging Equipment Market Size by Type 5.1.1 Global IC Advanced Packaging Equipment Revenue and Forecast Analysis by Type (2019-2030) 5.1.2 Global IC Advanced Packaging Equipment Sales and Forecast Analysis by Type (2019-2030) 5.2 Global IC Advanced Packaging Equipment Market Size by Application 5.2.1 Global IC Advanced Packaging Equipment Revenue and Forecast Analysis by Application (2019-2030) 5.2.2 Global IC Advanced Packaging Equipment Sales and Forecast Analysis by Application (2019-2030) 6 North America 6.1 North America IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 6.2 North America Key Manufacturers Analysis 6.3 North America IC Advanced Packaging Equipment Market Size by Type 6.3.1 North America IC Advanced Packaging Equipment Sales by Type (2019-2030) 6.3.2 North America IC Advanced Packaging Equipment Revenue by Type (2019-2030) 6.4 North America IC Advanced Packaging Equipment Market Size by Application 6.4.1 North America IC Advanced Packaging Equipment Sales by Application (2019-2030) 6.4.2 North America IC Advanced Packaging Equipment Revenue by Application (2019-2030) 6.5 North America IC Advanced Packaging Equipment Market Size by Country 6.5.1 US 6.5.2 Canada 7 Europe 7.1 Europe IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 7.2 Europe Key Manufacturers Analysis 7.3 Europe IC Advanced Packaging Equipment Market Size by Type 7.3.1 Europe IC Advanced Packaging Equipment Sales by Type (2019-2030) 7.3.2 Europe IC Advanced Packaging Equipment Revenue by Type (2019-2030) 7.4 Europe IC Advanced Packaging Equipment Market Size by Application 7.4.1 Europe IC Advanced Packaging Equipment Sales by Application (2019-2030) 7.4.2 ? Europe IC Advanced Packaging Equipment Revenue by Application (2019-2030) 7.5 Europe IC Advanced Packaging Equipment Market Size by Country 7.5.1 Germany 7.5.2 France 7.5.3 United Kingdom 7.5.4 Italy 7.5.5 Spain 7.5.6 Benelux 8 China 8.1 China IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 8.2 China Key Manufacturers Analysis 8.3 China IC Advanced Packaging Equipment Market Size by Type 8.3.1 China IC Advanced Packaging Equipment Sales by Type (2019-2030) 8.3.2 China IC Advanced Packaging Equipment Revenue by Type (2019-2030) 8.4 China IC Advanced Packaging Equipment Market Size by Application 8.4.1 China IC Advanced Packaging Equipment Sales by Application (2019-2030) 8.4.2 China IC Advanced Packaging Equipment Revenue by Application (2019-2030) 9 APAC (excl. China) 9.1 APAC (excl. China) IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 9.2 APAC (excl. China) Key Manufacturers Analysis 9.3 APAC (excl. China) IC Advanced Packaging Equipment Market Size by Type 9.3.1 APAC (excl. China) IC Advanced Packaging Equipment Sales by Type (2019-2030) 9.3.2 APAC (excl. China) IC Advanced Packaging Equipment Revenue by Type (2019-2030) 9.4 APAC (excl. China) IC Advanced Packaging Equipment Market Size by Application 9.4.1 APAC (excl. China) IC Advanced Packaging Equipment Sales by Application (2019-2030) 9.4.2 APAC (excl. China) IC Advanced Packaging Equipment Revenue by Application (2019-2030) 9.5 APAC (excl. China) IC Advanced Packaging Equipment Market Size by Country 9.5.1 Japan 9.5.2 South Korea 9.5.3 India 9.5.4 Australia 9.5.5 Indonesia 9.5.6 Vietnam 9.5.7 Malaysia 9.5.8 Thailand 10 Latin America 10.1 Latin America IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 10.2 Latin America Key Manufacturers Analysis 10.3 Latin America IC Advanced Packaging Equipment Market Size by Type 10.3.1 Latin America IC Advanced Packaging Equipment Sales by Type (2019-2030) 10.3.2 Latin America IC Advanced Packaging Equipment Revenue by Type (2019-2030) 10.4 Latin America IC Advanced Packaging Equipment Market Size by Application 10.4.1 Latin America IC Advanced Packaging Equipment Sales by Application (2019-2030) 10.4.2 Latin America IC Advanced Packaging Equipment Revenue by Application (2019-2030) 10.5 Latin America IC Advanced Packaging Equipment Market Size by Country 10.5.1 Mexico 10.5.2 Brazil 11 Middle East & Africa 11.1 Middle East & Africa IC Advanced Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 11.2 Middle East & Africa Key Manufacturers Analysis 11.3 Middle East & Africa IC Advanced Packaging Equipment Market Size by Type 11.3.1 Middle East & Africa IC Advanced Packaging Equipment Sales by Type (2019-2030) 11.3.2 Middle East & Africa IC Advanced Packaging Equipment Revenue by Type (2019-2030) 11.4 Middle East & Africa IC Advanced Packaging Equipment Market Size by Application 11.4.1 Middle East & Africa IC Advanced Packaging Equipment Sales by Application (2019-2030) 11.4.2 Middle East & Africa IC Advanced Packaging Equipment Revenue by Application (2019-2030) 11.5 Middle East & Africa IC Advanced Packaging Equipment Market Size by Country 11.5.1 Saudi Arabia 11.5.2 South Africa 12 Competition by Manufacturers 12.1 Global IC Advanced Packaging Equipment Market Sales, Revenue and Price by Key Manufacturers (2020-2024) 12.1.1 Global IC Advanced Packaging Equipment Market Sales by Key Manufacturers (2020-2024) 12.1.2 Global IC Advanced Packaging Equipment Market Revenue by Key Manufacturers (2020-2024) 12.1.3 Global IC Advanced Packaging Equipment Average Sales Price by Manufacturers (2020-2024) 12.2 IC Advanced Packaging Equipment Competitive Landscape Analysis and Market Dynamic 12.2.1 IC Advanced Packaging Equipment Competitive Landscape Analysis 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales 12.2.3 Market Dynamic 13 Key Companies Analysis 13.1 ASM Pacific 13.1.1 ASM Pacific Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.1.2 ASM Pacific IC Advanced Packaging Equipment Product Portfolio 13.1.3 ASM Pacific IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.2 Applied Material 13.2.1 Applied Material Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.2.2 Applied Material IC Advanced Packaging Equipment Product Portfolio 13.2.3 Applied Material IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.3 Advantest 13.3.1 Advantest Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.3.2 Advantest IC Advanced Packaging Equipment Product Portfolio 13.3.3 Advantest IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.4 Kulicke&Soffa 13.4.1 Kulicke&Soffa Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.4.2 Kulicke&Soffa IC Advanced Packaging Equipment Product Portfolio 13.4.3 Kulicke&Soffa IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.5 DISCO 13.5.1 DISCO Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.5.2 DISCO IC Advanced Packaging Equipment Product Portfolio 13.5.3 DISCO IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.6 Tokyo Seimitsu 13.6.1 Tokyo Seimitsu Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.6.2 Tokyo Seimitsu IC Advanced Packaging Equipment Product Portfolio 13.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.7 BESI 13.7.1 BESI Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.7.2 BESI IC Advanced Packaging Equipment Product Portfolio 13.7.3 BESI IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.8 Hitachi 13.8.1 Hitachi Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.8.2 Hitachi IC Advanced Packaging Equipment Product Portfolio 13.8.3 Hitachi IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.9 Teradyne 13.9.1 Teradyne Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.9.2 Teradyne IC Advanced Packaging Equipment Product Portfolio 13.9.3 Teradyne IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.10 Hanmi 13.10.1 Hanmi Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.10.2 Hanmi IC Advanced Packaging Equipment Product Portfolio 13.10.3 Hanmi IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.11 Toray Engineering 13.11.1 Toray Engineering Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.11.2 Toray Engineering IC Advanced Packaging Equipment Product Portfolio 13.11.3 Toray Engineering IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.12 Shinkawa 13.12.1 Shinkawa Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.12.2 Shinkawa IC Advanced Packaging Equipment Product Portfolio 13.12.3 Shinkawa IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.13 TOWA 13.13.1 TOWA Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.13.2 TOWA IC Advanced Packaging Equipment Product Portfolio 13.13.3 TOWA IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.14 COHU Semiconductor 13.14.1 COHU Semiconductor Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.14.2 COHU Semiconductor IC Advanced Packaging Equipment Product Portfolio 13.14.3 COHU Semiconductor IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.15 SUSS Microtec 13.15.1 SUSS Microtec Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.15.2 SUSS Microtec IC Advanced Packaging Equipment Product Portfolio 13.15.3 SUSS Microtec IC Advanced Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 14 Industry Chain Analysis 14.1 IC Advanced Packaging Equipment Industry Chain Analysis 14.2 IC Advanced Packaging Equipment Industry Upstream Supply Analysis 14.2.1 Upstream Key Raw Material Supply Analysis 14.2.2 Raw Material Suppliers and Contact Information 14.3 IC Advanced Packaging Equipment Typical Downstream Customers 14.4 IC Advanced Packaging Equipment Sales Channel Analysis 15 Research Findings and Conclusion 16 Methodology and Data Source 16.1 Methodology/Research Approach 16.2 Research Scope 16.3 Benchmarks and Assumptions 16.4 Date Source 16.4.1 Primary Sources 16.4.2 Secondary Sources 16.5 Data Cross Validation 16.6 Disclaimer
Publisher: DIResearch
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