Research Summary
IC packaging, short for Integrated Circuit packaging, refers to the process of enclosing a semiconductor device, or integrated circuit (IC), within a protective and functional housing. The primary objective of IC packaging is to provide a secure environment for the delicate semiconductor components, safeguarding them from external factors such as moisture, mechanical stress, and environmental contaminants. Additionally, IC packaging serves as a means to facilitate the electrical connections between the integrated circuit and the external world, enabling it to be easily integrated into electronic systems. Various packaging technologies exist, ranging from traditional dual in-line packages (DIP) to more advanced and compact forms like chip-on-board (COB) or surface mount device (SMD) packages. The choice of IC packaging is crucial in determining factors such as thermal performance, signal integrity, and overall reliability of the integrated circuit in its intended application.
According to DIResearch's in-depth investigation and research, the global IC Packaging market size will reach US$ Million in 2024, and is expected to reach US$ Million in 2030, with a CAGR of % (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ Million, accounting for approximately % of the world. It is expected to reach US$ Million in 2030, and the global share will reach %.
The major global manufacturers of IC Packaging include ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond, KYEC, STS Semiconductor, Huatian, MPl(Carsem), Nepes, FATC, Walton, NantongFujitsu Microelectronics, Unisem, Hana Micron, Signetics, LINGSEN etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of IC Packaging. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global IC Packaging market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the IC Packaging market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of IC Packaging industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy. ? ?
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of IC Packaging Include:
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
KYEC
STS Semiconductor
Huatian
MPl(Carsem)
Nepes
FATC
Walton
NantongFujitsu Microelectronics
Unisem
Hana Micron
Signetics
LINGSEN
IC Packaging Product Segment Include:
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others
IC Packaging Product Application Include:
CIS
MEMS
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global IC Packaging Industry PESTEL Analysis
Chapter 3: Global IC Packaging Industry Porter's Five Forces Analysis
Chapter 4: Global IC Packaging Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global IC Packaging Market Size and Forecast by Type and Application Analysis
Chapter 6: North America IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa IC Packaging Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global IC Packaging Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents 1 IC Packaging Market Overview 1.1 Product Definition and Statistical Scope 1.2 IC Packaging Product by Type 1.2.1 Global IC Packaging Market Size by Type, 2023 VS 2024 VS 2030 1.2.2 DIP 1.2.3 SOP 1.2.4 QFP 1.2.5 QFN 1.2.6 BGA 1.2.7 CSP 1.2.8 LGA 1.2.9 WLP 1.2.10 FC 1.2.11 Others 1.3 IC Packaging Product by Application 1.3.1 Global IC Packaging Market Size by Application, 2023 VS 2024 VS 2030 1.3.2 CIS 1.3.3 MEMS 1.3.4 Others 1.4 Global IC Packaging Market Revenue and Sales Analysis 1.4.1 Global IC Packaging Market Size Analysis (2019-2030) 1.4.2 Global IC Packaging Market Sales Analysis (2019-2030) 1.4.3 Global IC Packaging Market Sales Price Trend Analysis (2019-2030) 1.5 IC Packaging Market Development Status and Trends 1.5.1 IC Packaging Industry Development Status Analysis 1.5.2 IC Packaging Industry Development Trends Analysis 2 IC Packaging Market PESTEL Analysis 2.1 Political Factors Analysis 2.2 Economic Factors Analysis 2.3 Social Factors Analysis 2.4 Technological Factors Analysis 2.5 Environmental Factors Analysis 2.6 Legal Factors Analysis 3 IC Packaging Market Porter's Five Forces Analysis 3.1 Competitive Rivalry 3.2 Threat of New Entrants 3.3 Bargaining Power of Suppliers 3.4 Bargaining Power of Buyers 3.5 Threat of Substitutes 4 Global IC Packaging Market Analysis by Regions 4.1 IC Packaging Overall Market: 2023 VS 2024 VS 2030 4.2 Global IC Packaging Revenue and Forecast Analysis (2019-2030) 4.2.1 Global IC Packaging Revenue and Market Share by Region (2019-2024) 4.2.2 Global IC Packaging Revenue Forecast by Region (2025-2030) 4.3 Global IC Packaging Sales and Forecast Analysis (2019-2030) 4.3.1 Global IC Packaging Sales and Market Share by Region (2019-2024) 4.3.2 Global IC Packaging Sales Forecast by Region (2025-2030) 4.4 Global IC Packaging Sales Price Trend Analysis (2019-2030) 5 Global IC Packaging Market Size by Type and Application 5.1 Global IC Packaging Market Size by Type 5.1.1 Global IC Packaging Revenue and Forecast Analysis by Type (2019-2030) 5.1.2 Global IC Packaging Sales and Forecast Analysis by Type (2019-2030) 5.2 Global IC Packaging Market Size by Application 5.2.1 Global IC Packaging Revenue and Forecast Analysis by Application (2019-2030) 5.2.2 Global IC Packaging Sales and Forecast Analysis by Application (2019-2030) 6 North America 6.1 North America IC Packaging Market Size and Growth Rate Analysis (2019-2030) 6.2 North America Key Manufacturers Analysis 6.3 North America IC Packaging Market Size by Type 6.3.1 North America IC Packaging Sales by Type (2019-2030) 6.3.2 North America IC Packaging Revenue by Type (2019-2030) 6.4 North America IC Packaging Market Size by Application 6.4.1 North America IC Packaging Sales by Application (2019-2030) 6.4.2 North America IC Packaging Revenue by Application (2019-2030) 6.5 North America IC Packaging Market Size by Country 6.5.1 US 6.5.2 Canada 7 Europe 7.1 Europe IC Packaging Market Size and Growth Rate Analysis (2019-2030) 7.2 Europe Key Manufacturers Analysis 7.3 Europe IC Packaging Market Size by Type 7.3.1 Europe IC Packaging Sales by Type (2019-2030) 7.3.2 Europe IC Packaging Revenue by Type (2019-2030) 7.4 Europe IC Packaging Market Size by Application 7.4.1 Europe IC Packaging Sales by Application (2019-2030) 7.4.2 ? Europe IC Packaging Revenue by Application (2019-2030) 7.5 Europe IC Packaging Market Size by Country 7.5.1 Germany 7.5.2 France 7.5.3 United Kingdom 7.5.4 Italy 7.5.5 Spain 7.5.6 Benelux 8 China 8.1 China IC Packaging Market Size and Growth Rate Analysis (2019-2030) 8.2 China Key Manufacturers Analysis 8.3 China IC Packaging Market Size by Type 8.3.1 China IC Packaging Sales by Type (2019-2030) 8.3.2 China IC Packaging Revenue by Type (2019-2030) 8.4 China IC Packaging Market Size by Application 8.4.1 China IC Packaging Sales by Application (2019-2030) 8.4.2 China IC Packaging Revenue by Application (2019-2030) 9 APAC (excl. China) 9.1 APAC (excl. China) IC Packaging Market Size and Growth Rate Analysis (2019-2030) 9.2 APAC (excl. China) Key Manufacturers Analysis 9.3 APAC (excl. China) IC Packaging Market Size by Type 9.3.1 APAC (excl. China) IC Packaging Sales by Type (2019-2030) 9.3.2 APAC (excl. China) IC Packaging Revenue by Type (2019-2030) 9.4 APAC (excl. China) IC Packaging Market Size by Application 9.4.1 APAC (excl. China) IC Packaging Sales by Application (2019-2030) 9.4.2 APAC (excl. China) IC Packaging Revenue by Application (2019-2030) 9.5 APAC (excl. China) IC Packaging Market Size by Country 9.5.1 Japan 9.5.2 South Korea 9.5.3 India 9.5.4 Australia 9.5.5 Indonesia 9.5.6 Vietnam 9.5.7 Malaysia 9.5.8 Thailand 10 Latin America 10.1 Latin America IC Packaging Market Size and Growth Rate Analysis (2019-2030) 10.2 Latin America Key Manufacturers Analysis 10.3 Latin America IC Packaging Market Size by Type 10.3.1 Latin America IC Packaging Sales by Type (2019-2030) 10.3.2 Latin America IC Packaging Revenue by Type (2019-2030) 10.4 Latin America IC Packaging Market Size by Application 10.4.1 Latin America IC Packaging Sales by Application (2019-2030) 10.4.2 Latin America IC Packaging Revenue by Application (2019-2030) 10.5 Latin America IC Packaging Market Size by Country 10.5.1 Mexico 10.5.2 Brazil 11 Middle East & Africa 11.1 Middle East & Africa IC Packaging Market Size and Growth Rate Analysis (2019-2030) 11.2 Middle East & Africa Key Manufacturers Analysis 11.3 Middle East & Africa IC Packaging Market Size by Type 11.3.1 Middle East & Africa IC Packaging Sales by Type (2019-2030) 11.3.2 Middle East & Africa IC Packaging Revenue by Type (2019-2030) 11.4 Middle East & Africa IC Packaging Market Size by Application 11.4.1 Middle East & Africa IC Packaging Sales by Application (2019-2030) 11.4.2 Middle East & Africa IC Packaging Revenue by Application (2019-2030) 11.5 Middle East & Africa IC Packaging Market Size by Country 11.5.1 Saudi Arabia 11.5.2 South Africa 12 Competition by Manufacturers 12.1 Global IC Packaging Market Sales, Revenue and Price by Key Manufacturers (2020-2024) 12.1.1 Global IC Packaging Market Sales by Key Manufacturers (2020-2024) 12.1.2 Global IC Packaging Market Revenue by Key Manufacturers (2020-2024) 12.1.3 Global IC Packaging Average Sales Price by Manufacturers (2020-2024) 12.2 IC Packaging Competitive Landscape Analysis and Market Dynamic 12.2.1 IC Packaging Competitive Landscape Analysis 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales 12.2.3 Market Dynamic 13 Key Companies Analysis 13.1 ASE 13.1.1 ASE Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.1.2 ASE IC Packaging Product Portfolio 13.1.3 ASE IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.2 Amkor 13.2.1 Amkor Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.2.2 Amkor IC Packaging Product Portfolio 13.2.3 Amkor IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.3 SPIL 13.3.1 SPIL Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.3.2 SPIL IC Packaging Product Portfolio 13.3.3 SPIL IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.4 STATS ChipPac 13.4.1 STATS ChipPac Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.4.2 STATS ChipPac IC Packaging Product Portfolio 13.4.3 STATS ChipPac IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.5 Powertech Technology 13.5.1 Powertech Technology Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.5.2 Powertech Technology IC Packaging Product Portfolio 13.5.3 Powertech Technology IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.6 J-devices 13.6.1 J-devices Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.6.2 J-devices IC Packaging Product Portfolio 13.6.3 J-devices IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.7 UTAC 13.7.1 UTAC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.7.2 UTAC IC Packaging Product Portfolio 13.7.3 UTAC IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.8 JECT 13.8.1 JECT Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.8.2 JECT IC Packaging Product Portfolio 13.8.3 JECT IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.9 ChipMOS 13.9.1 ChipMOS Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.9.2 ChipMOS IC Packaging Product Portfolio 13.9.3 ChipMOS IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.10 Chipbond 13.10.1 Chipbond Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.10.2 Chipbond IC Packaging Product Portfolio 13.10.3 Chipbond IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.11 KYEC 13.11.1 KYEC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.11.2 KYEC IC Packaging Product Portfolio 13.11.3 KYEC IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.12 STS Semiconductor 13.12.1 STS Semiconductor Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.12.2 STS Semiconductor IC Packaging Product Portfolio 13.12.3 STS Semiconductor IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.13 Huatian 13.13.1 Huatian Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.13.2 Huatian IC Packaging Product Portfolio 13.13.3 Huatian IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.14 MPl(Carsem) 13.14.1 MPl(Carsem) Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.14.2 MPl(Carsem) IC Packaging Product Portfolio 13.14.3 MPl(Carsem) IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.15 Nepes 13.15.1 Nepes Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.15.2 Nepes IC Packaging Product Portfolio 13.15.3 Nepes IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.16 FATC 13.16.1 FATC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.16.2 FATC IC Packaging Product Portfolio 13.16.3 FATC IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.17 Walton 13.17.1 Walton Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.17.2 Walton IC Packaging Product Portfolio 13.17.3 Walton IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.18 NantongFujitsu Microelectronics 13.18.1 NantongFujitsu Microelectronics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.18.2 NantongFujitsu Microelectronics IC Packaging Product Portfolio 13.18.3 NantongFujitsu Microelectronics IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.19 Unisem 13.19.1 Unisem Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.19.2 Unisem IC Packaging Product Portfolio 13.19.3 Unisem IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.20 Hana Micron 13.20.1 Hana Micron Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.20.2 Hana Micron IC Packaging Product Portfolio 13.20.3 Hana Micron IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.21 Signetics 13.21.1 Signetics Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.21.2 Signetics IC Packaging Product Portfolio 13.21.3 Signetics IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.22 LINGSEN 13.22.1 LINGSEN Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.22.2 LINGSEN IC Packaging Product Portfolio 13.22.3 LINGSEN IC Packaging Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 14 Industry Chain Analysis 14.1 IC Packaging Industry Chain Analysis 14.2 IC Packaging Industry Upstream Supply Analysis 14.2.1 Upstream Key Raw Material Supply Analysis 14.2.2 Raw Material Suppliers and Contact Information 14.3 IC Packaging Typical Downstream Customers 14.4 IC Packaging Sales Channel Analysis 15 Research Findings and Conclusion 16 Methodology and Data Source 16.1 Methodology/Research Approach 16.2 Research Scope 16.3 Benchmarks and Assumptions 16.4 Date Source 16.4.1 Primary Sources 16.4.2 Secondary Sources 16.5 Data Cross Validation 16.6 Disclaimer
Publisher: DIResearch
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