Research Summary
Wafer-level packaging equipment refers to specialized machinery and tools used in semiconductor manufacturing for packaging semiconductor devices directly on the wafer level, rather than individually packaging each die after wafer dicing. This approach offers several advantages, including increased throughput, reduced cost, and improved performance of the packaged devices. Wafer-level packaging equipment typically includes various processes such as redistribution layer (RDL) deposition, bumping, wafer thinning, wafer dicing, and encapsulation. These processes are performed using advanced equipment such as deposition systems, lithography tools, bonding machines, etching systems, and inspection systems. Wafer-level packaging equipment enables the integration of multiple functions, such as electrical connections, thermal management, and protection, directly onto the wafer, resulting in highly compact and efficient semiconductor devices. This technology is widely used in applications such as microelectromechanical systems (MEMS), sensors, radio frequency (RF) devices, and advanced integrated circuits.
According to DIResearch's in-depth investigation and research, the global Wafer-level Packaging Equipment market size will reach US$ Million in 2024, and is expected to reach US$ Million in 2030, with a CAGR of % (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ Million, accounting for approximately % of the world. It is expected to reach US$ Million in 2030, and the global share will reach %.
The major global manufacturers of Wafer-level Packaging Equipment include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, Tokyo Seimitsu, Disco, SEMES, Suss Microtec, Veeco/CNT, Rudolph Technologies etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Wafer-level Packaging Equipment. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer-level Packaging Equipment market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Wafer-level Packaging Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer-level Packaging Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy. ? ?
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Wafer-level Packaging Equipment Include:
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies
Wafer-level Packaging Equipment Product Segment Include:
Fan In
Fan Out
Others
Wafer-level Packaging Equipment Product Application Include:
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Wafer-level Packaging Equipment Industry PESTEL Analysis
Chapter 3: Global Wafer-level Packaging Equipment Industry Porter's Five Forces Analysis
Chapter 4: Global Wafer-level Packaging Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global Wafer-level Packaging Equipment Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Wafer-level Packaging Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Wafer-level Packaging Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents 1 Wafer-level Packaging Equipment Market Overview 1.1 Product Definition and Statistical Scope 1.2 Wafer-level Packaging Equipment Product by Type 1.2.1 Global Wafer-level Packaging Equipment Market Size by Type, 2023 VS 2024 VS 2030 1.2.2 Fan In 1.2.3 Fan Out 1.2.4 Others 1.3 Wafer-level Packaging Equipment Product by Application 1.3.1 Global Wafer-level Packaging Equipment Market Size by Application, 2023 VS 2024 VS 2030 1.3.2 Integrated Circuit Fabrication Process 1.3.3 Semiconductor Industry 1.3.4 Microelectromechanical Systems (MEMS) 1.3.5 Other 1.4 Global Wafer-level Packaging Equipment Market Revenue and Sales Analysis 1.4.1 Global Wafer-level Packaging Equipment Market Size Analysis (2019-2030) 1.4.2 Global Wafer-level Packaging Equipment Market Sales Analysis (2019-2030) 1.4.3 Global Wafer-level Packaging Equipment Market Sales Price Trend Analysis (2019-2030) 1.5 Wafer-level Packaging Equipment Market Development Status and Trends 1.5.1 Wafer-level Packaging Equipment Industry Development Status Analysis 1.5.2 Wafer-level Packaging Equipment Industry Development Trends Analysis 2 Wafer-level Packaging Equipment Market PESTEL Analysis 2.1 Political Factors Analysis 2.2 Economic Factors Analysis 2.3 Social Factors Analysis 2.4 Technological Factors Analysis 2.5 Environmental Factors Analysis 2.6 Legal Factors Analysis 3 Wafer-level Packaging Equipment Market Porter's Five Forces Analysis 3.1 Competitive Rivalry 3.2 Threat of New Entrants 3.3 Bargaining Power of Suppliers 3.4 Bargaining Power of Buyers 3.5 Threat of Substitutes 4 Global Wafer-level Packaging Equipment Market Analysis by Regions 4.1 Wafer-level Packaging Equipment Overall Market: 2023 VS 2024 VS 2030 4.2 Global Wafer-level Packaging Equipment Revenue and Forecast Analysis (2019-2030) 4.2.1 Global Wafer-level Packaging Equipment Revenue and Market Share by Region (2019-2024) 4.2.2 Global Wafer-level Packaging Equipment Revenue Forecast by Region (2025-2030) 4.3 Global Wafer-level Packaging Equipment Sales and Forecast Analysis (2019-2030) 4.3.1 Global Wafer-level Packaging Equipment Sales and Market Share by Region (2019-2024) 4.3.2 Global Wafer-level Packaging Equipment Sales Forecast by Region (2025-2030) 4.4 Global Wafer-level Packaging Equipment Sales Price Trend Analysis (2019-2030) 5 Global Wafer-level Packaging Equipment Market Size by Type and Application 5.1 Global Wafer-level Packaging Equipment Market Size by Type 5.1.1 Global Wafer-level Packaging Equipment Revenue and Forecast Analysis by Type (2019-2030) 5.1.2 Global Wafer-level Packaging Equipment Sales and Forecast Analysis by Type (2019-2030) 5.2 Global Wafer-level Packaging Equipment Market Size by Application 5.2.1 Global Wafer-level Packaging Equipment Revenue and Forecast Analysis by Application (2019-2030) 5.2.2 Global Wafer-level Packaging Equipment Sales and Forecast Analysis by Application (2019-2030) 6 North America 6.1 North America Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 6.2 North America Key Manufacturers Analysis 6.3 North America Wafer-level Packaging Equipment Market Size by Type 6.3.1 North America Wafer-level Packaging Equipment Sales by Type (2019-2030) 6.3.2 North America Wafer-level Packaging Equipment Revenue by Type (2019-2030) 6.4 North America Wafer-level Packaging Equipment Market Size by Application 6.4.1 North America Wafer-level Packaging Equipment Sales by Application (2019-2030) 6.4.2 North America Wafer-level Packaging Equipment Revenue by Application (2019-2030) 6.5 North America Wafer-level Packaging Equipment Market Size by Country 6.5.1 US 6.5.2 Canada 7 Europe 7.1 Europe Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 7.2 Europe Key Manufacturers Analysis 7.3 Europe Wafer-level Packaging Equipment Market Size by Type 7.3.1 Europe Wafer-level Packaging Equipment Sales by Type (2019-2030) 7.3.2 Europe Wafer-level Packaging Equipment Revenue by Type (2019-2030) 7.4 Europe Wafer-level Packaging Equipment Market Size by Application 7.4.1 Europe Wafer-level Packaging Equipment Sales by Application (2019-2030) 7.4.2 ? Europe Wafer-level Packaging Equipment Revenue by Application (2019-2030) 7.5 Europe Wafer-level Packaging Equipment Market Size by Country 7.5.1 Germany 7.5.2 France 7.5.3 United Kingdom 7.5.4 Italy 7.5.5 Spain 7.5.6 Benelux 8 China 8.1 China Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 8.2 China Key Manufacturers Analysis 8.3 China Wafer-level Packaging Equipment Market Size by Type 8.3.1 China Wafer-level Packaging Equipment Sales by Type (2019-2030) 8.3.2 China Wafer-level Packaging Equipment Revenue by Type (2019-2030) 8.4 China Wafer-level Packaging Equipment Market Size by Application 8.4.1 China Wafer-level Packaging Equipment Sales by Application (2019-2030) 8.4.2 China Wafer-level Packaging Equipment Revenue by Application (2019-2030) 9 APAC (excl. China) 9.1 APAC (excl. China) Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 9.2 APAC (excl. China) Key Manufacturers Analysis 9.3 APAC (excl. China) Wafer-level Packaging Equipment Market Size by Type 9.3.1 APAC (excl. China) Wafer-level Packaging Equipment Sales by Type (2019-2030) 9.3.2 APAC (excl. China) Wafer-level Packaging Equipment Revenue by Type (2019-2030) 9.4 APAC (excl. China) Wafer-level Packaging Equipment Market Size by Application 9.4.1 APAC (excl. China) Wafer-level Packaging Equipment Sales by Application (2019-2030) 9.4.2 APAC (excl. China) Wafer-level Packaging Equipment Revenue by Application (2019-2030) 9.5 APAC (excl. China) Wafer-level Packaging Equipment Market Size by Country 9.5.1 Japan 9.5.2 South Korea 9.5.3 India 9.5.4 Australia 9.5.5 Indonesia 9.5.6 Vietnam 9.5.7 Malaysia 9.5.8 Thailand 10 Latin America 10.1 Latin America Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 10.2 Latin America Key Manufacturers Analysis 10.3 Latin America Wafer-level Packaging Equipment Market Size by Type 10.3.1 Latin America Wafer-level Packaging Equipment Sales by Type (2019-2030) 10.3.2 Latin America Wafer-level Packaging Equipment Revenue by Type (2019-2030) 10.4 Latin America Wafer-level Packaging Equipment Market Size by Application 10.4.1 Latin America Wafer-level Packaging Equipment Sales by Application (2019-2030) 10.4.2 Latin America Wafer-level Packaging Equipment Revenue by Application (2019-2030) 10.5 Latin America Wafer-level Packaging Equipment Market Size by Country 10.5.1 Mexico 10.5.2 Brazil 11 Middle East & Africa 11.1 Middle East & Africa Wafer-level Packaging Equipment Market Size and Growth Rate Analysis (2019-2030) 11.2 Middle East & Africa Key Manufacturers Analysis 11.3 Middle East & Africa Wafer-level Packaging Equipment Market Size by Type 11.3.1 Middle East & Africa Wafer-level Packaging Equipment Sales by Type (2019-2030) 11.3.2 Middle East & Africa Wafer-level Packaging Equipment Revenue by Type (2019-2030) 11.4 Middle East & Africa Wafer-level Packaging Equipment Market Size by Application 11.4.1 Middle East & Africa Wafer-level Packaging Equipment Sales by Application (2019-2030) 11.4.2 Middle East & Africa Wafer-level Packaging Equipment Revenue by Application (2019-2030) 11.5 Middle East & Africa Wafer-level Packaging Equipment Market Size by Country 11.5.1 Saudi Arabia 11.5.2 South Africa 12 Competition by Manufacturers 12.1 Global Wafer-level Packaging Equipment Market Sales, Revenue and Price by Key Manufacturers (2020-2024) 12.1.1 Global Wafer-level Packaging Equipment Market Sales by Key Manufacturers (2020-2024) 12.1.2 Global Wafer-level Packaging Equipment Market Revenue by Key Manufacturers (2020-2024) 12.1.3 Global Wafer-level Packaging Equipment Average Sales Price by Manufacturers (2020-2024) 12.2 Wafer-level Packaging Equipment Competitive Landscape Analysis and Market Dynamic 12.2.1 Wafer-level Packaging Equipment Competitive Landscape Analysis 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales 12.2.3 Market Dynamic 13 Key Companies Analysis 13.1 Applied Materials 13.1.1 Applied Materials Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.1.2 Applied Materials Wafer-level Packaging Equipment Product Portfolio 13.1.3 Applied Materials Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.2 Tokyo Electron 13.2.1 Tokyo Electron Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.2.2 Tokyo Electron Wafer-level Packaging Equipment Product Portfolio 13.2.3 Tokyo Electron Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.3 KLA-Tencor Corporation 13.3.1 KLA-Tencor Corporation Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.3.2 KLA-Tencor Corporation Wafer-level Packaging Equipment Product Portfolio 13.3.3 KLA-Tencor Corporation Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.4 EV Group 13.4.1 EV Group Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.4.2 EV Group Wafer-level Packaging Equipment Product Portfolio 13.4.3 EV Group Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.5 Tokyo Seimitsu 13.5.1 Tokyo Seimitsu Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.5.2 Tokyo Seimitsu Wafer-level Packaging Equipment Product Portfolio 13.5.3 Tokyo Seimitsu Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.6 Disco 13.6.1 Disco Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.6.2 Disco Wafer-level Packaging Equipment Product Portfolio 13.6.3 Disco Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.7 SEMES 13.7.1 SEMES Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.7.2 SEMES Wafer-level Packaging Equipment Product Portfolio 13.7.3 SEMES Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.8 Suss Microtec 13.8.1 Suss Microtec Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.8.2 Suss Microtec Wafer-level Packaging Equipment Product Portfolio 13.8.3 Suss Microtec Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.9 Veeco/CNT 13.9.1 Veeco/CNT Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.9.2 Veeco/CNT Wafer-level Packaging Equipment Product Portfolio 13.9.3 Veeco/CNT Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.10 Rudolph Technologies 13.10.1 Rudolph Technologies Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.10.2 Rudolph Technologies Wafer-level Packaging Equipment Product Portfolio 13.10.3 Rudolph Technologies Wafer-level Packaging Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 14 Industry Chain Analysis 14.1 Wafer-level Packaging Equipment Industry Chain Analysis 14.2 Wafer-level Packaging Equipment Industry Upstream Supply Analysis 14.2.1 Upstream Key Raw Material Supply Analysis 14.2.2 Raw Material Suppliers and Contact Information 14.3 Wafer-level Packaging Equipment Typical Downstream Customers 14.4 Wafer-level Packaging Equipment Sales Channel Analysis 15 Research Findings and Conclusion 16 Methodology and Data Source 16.1 Methodology/Research Approach 16.2 Research Scope 16.3 Benchmarks and Assumptions 16.4 Date Source 16.4.1 Primary Sources 16.4.2 Secondary Sources 16.5 Data Cross Validation 16.6 Disclaimer
Publisher: DIResearch
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