Global Wafer Slicing Equipment Competitive Landscape Professional Research Report 2024

Research Summary

Wafer slicing equipment refers to machinery and tools used in semiconductor manufacturing to slice semiconductor ingots or boules into thin, flat wafers. This process, known as wafer slicing or wafering, is a critical step in semiconductor fabrication, as it produces the substrates on which integrated circuits and other semiconductor devices are built. Wafer slicing equipment typically includes diamond wire saws or wafering saws equipped with precision blades made of diamond or other hard materials. These saws cut semiconductor ingots into wafers with precise thickness and uniformity, ensuring consistency and quality in the resulting semiconductor devices. Wafer slicing equipment is designed to operate under controlled conditions to minimize damage to the wafers and optimize yield. It plays a crucial role in semiconductor manufacturing by enabling the mass production of high-quality semiconductor wafers for use in a wide range of electronic applications.

According to DIResearch's in-depth investigation and research, the global Wafer Slicing Equipment market size will reach US$ Million in 2024, and is expected to reach US$ Million in 2030, with a CAGR of % (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ Million, accounting for approximately % of the world. It is expected to reach US$ Million in 2030, and the global share will reach %.

The major global manufacturers of Wafer Slicing Equipment include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.

This report studies the market size, price trends and future development prospects of Wafer Slicing Equipment. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Slicing Equipment market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.

The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Wafer Slicing Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Slicing Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy. ?  ?

The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.

Global Key Manufacturers of Wafer Slicing Equipment Include:

DISCO

Tokyo Seimitsu

GL Tech Co Ltd

ASM

Synova

CETC Electronics Equipment Group Co., Ltd.

Shenyang Heyan Technology Co., Ltd.

Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.

Hi-TESI

Tensun

Wafer Slicing Equipment Product Segment Include:

Blade Cutting Machine

Laser Cutting Machine

Wafer Slicing Equipment Product Application Include:

Pure Foundry

IDM

OSAT

LED

Photovoltaic

Chapter Scope

Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends

Chapter 2: Global Wafer Slicing Equipment Industry PESTEL Analysis

Chapter 3: Global Wafer Slicing Equipment Industry Porter's Five Forces Analysis

Chapter 4: Global Wafer Slicing Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis

Chapter 5: Global Wafer Slicing Equipment Market Size and Forecast by Type and Application Analysis

Chapter 6: North America Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 7: Europe Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 8: China Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 9: APAC (Excl. China) Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 10: Latin America Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 11: Middle East and Africa Wafer Slicing Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)

Chapter 12: Global Wafer Slicing Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)

Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)

Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers

Chapter 15: Research Findings and Conclusion

Chapter 16: Methodology and Data Sources

Table of Contents

1 Wafer Slicing Equipment Market Overview

1.1 Product Definition and Statistical Scope

1.2 Wafer Slicing Equipment Product by Type

1.2.1 Global Wafer Slicing Equipment Market Size by Type, 2023 VS 2024 VS 2030

1.2.2 Blade Cutting Machine

1.2.3 Laser Cutting Machine

1.3 Wafer Slicing Equipment Product by Application

1.3.1 Global Wafer Slicing Equipment Market Size by Application, 2023 VS 2024 VS 2030

1.3.2 Pure Foundry

1.3.3 IDM

1.3.4 OSAT

1.3.5 LED

1.3.6 Photovoltaic

1.4 Global Wafer Slicing Equipment Market Revenue and Sales Analysis

1.4.1 Global Wafer Slicing Equipment Market Size Analysis (2019-2030)

1.4.2 Global Wafer Slicing Equipment Market Sales Analysis (2019-2030)

1.4.3 Global Wafer Slicing Equipment Market Sales Price Trend Analysis (2019-2030)

1.5 Wafer Slicing Equipment Market Development Status and Trends

1.5.1 Wafer Slicing Equipment Industry Development Status Analysis

1.5.2 Wafer Slicing Equipment Industry Development Trends Analysis

2 Wafer Slicing Equipment Market PESTEL Analysis

2.1 Political Factors Analysis

2.2 Economic Factors Analysis

2.3 Social Factors Analysis

2.4 Technological Factors Analysis

2.5 Environmental Factors Analysis

2.6 Legal Factors Analysis

3 Wafer Slicing Equipment Market Porter's Five Forces Analysis

3.1 Competitive Rivalry

3.2 Threat of New Entrants

3.3 Bargaining Power of Suppliers

3.4 Bargaining Power of Buyers

3.5 Threat of Substitutes

4 Global Wafer Slicing Equipment Market Analysis by Regions

4.1 Wafer Slicing Equipment Overall Market: 2023 VS 2024 VS 2030

4.2 Global Wafer Slicing Equipment Revenue and Forecast Analysis (2019-2030)

4.2.1 Global Wafer Slicing Equipment Revenue and Market Share by Region (2019-2024)

4.2.2 Global Wafer Slicing Equipment Revenue Forecast by Region (2025-2030)

4.3 Global Wafer Slicing Equipment Sales and Forecast Analysis (2019-2030)

4.3.1 Global Wafer Slicing Equipment Sales and Market Share by Region (2019-2024)

4.3.2 Global Wafer Slicing Equipment Sales Forecast by Region (2025-2030)

4.4 Global Wafer Slicing Equipment Sales Price Trend Analysis (2019-2030)

5 Global Wafer Slicing Equipment Market Size by Type and Application

5.1 Global Wafer Slicing Equipment Market Size by Type

5.1.1 Global Wafer Slicing Equipment Revenue and Forecast Analysis by Type (2019-2030)

5.1.2 Global Wafer Slicing Equipment Sales and Forecast Analysis by Type (2019-2030)

5.2 Global Wafer Slicing Equipment Market Size by Application

5.2.1 Global Wafer Slicing Equipment Revenue and Forecast Analysis by Application (2019-2030)

5.2.2 Global Wafer Slicing Equipment Sales and Forecast Analysis by Application (2019-2030)

6 North America

6.1 North America Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

6.2 North America Key Manufacturers Analysis

6.3 North America Wafer Slicing Equipment Market Size by Type

6.3.1 North America Wafer Slicing Equipment Sales by Type (2019-2030)

6.3.2 North America Wafer Slicing Equipment Revenue by Type (2019-2030)

6.4 North America Wafer Slicing Equipment Market Size by Application

6.4.1 North America Wafer Slicing Equipment Sales by Application (2019-2030)

6.4.2 North America Wafer Slicing Equipment Revenue by Application (2019-2030)

6.5 North America Wafer Slicing Equipment Market Size by Country

6.5.1 US

6.5.2 Canada

7 Europe

7.1 Europe Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

7.2 Europe Key Manufacturers Analysis

7.3 Europe Wafer Slicing Equipment Market Size by Type

7.3.1 Europe Wafer Slicing Equipment Sales by Type (2019-2030)

7.3.2 Europe Wafer Slicing Equipment Revenue by Type (2019-2030)

7.4 Europe Wafer Slicing Equipment Market Size by Application

7.4.1 Europe Wafer Slicing Equipment Sales by Application (2019-2030)

7.4.2 ? Europe Wafer Slicing Equipment Revenue by Application (2019-2030)

7.5 Europe Wafer Slicing Equipment Market Size by Country

7.5.1 Germany

7.5.2 France

7.5.3 United Kingdom

7.5.4 Italy

7.5.5 Spain

7.5.6 Benelux

8 China

8.1 China Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

8.2 China Key Manufacturers Analysis

8.3 China Wafer Slicing Equipment Market Size by Type

8.3.1 China Wafer Slicing Equipment Sales by Type (2019-2030)

8.3.2 China Wafer Slicing Equipment Revenue by Type (2019-2030)

8.4 China Wafer Slicing Equipment Market Size by Application

8.4.1 China Wafer Slicing Equipment Sales by Application (2019-2030)

8.4.2 China Wafer Slicing Equipment Revenue by Application (2019-2030)

9 APAC (excl. China)

9.1 APAC (excl. China) Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

9.2 APAC (excl. China) Key Manufacturers Analysis

9.3 APAC (excl. China) Wafer Slicing Equipment Market Size by Type

9.3.1 APAC (excl. China) Wafer Slicing Equipment Sales by Type (2019-2030)

9.3.2 APAC (excl. China) Wafer Slicing Equipment Revenue by Type (2019-2030)

9.4 APAC (excl. China) Wafer Slicing Equipment Market Size by Application

9.4.1 APAC (excl. China) Wafer Slicing Equipment Sales by Application (2019-2030)

9.4.2 APAC (excl. China) Wafer Slicing Equipment Revenue by Application (2019-2030)

9.5 APAC (excl. China) Wafer Slicing Equipment Market Size by Country

9.5.1 Japan

9.5.2 South Korea

9.5.3 India

9.5.4 Australia

9.5.5 Indonesia

9.5.6 Vietnam

9.5.7 Malaysia

9.5.8 Thailand

10 Latin America

10.1 Latin America Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

10.2 Latin America Key Manufacturers Analysis

10.3 Latin America Wafer Slicing Equipment Market Size by Type

10.3.1 Latin America Wafer Slicing Equipment Sales by Type (2019-2030)

10.3.2 Latin America Wafer Slicing Equipment Revenue by Type (2019-2030)

10.4 Latin America Wafer Slicing Equipment Market Size by Application

10.4.1 Latin America Wafer Slicing Equipment Sales by Application (2019-2030)

10.4.2 Latin America Wafer Slicing Equipment Revenue by Application (2019-2030)

10.5 Latin America Wafer Slicing Equipment Market Size by Country

10.5.1 Mexico

10.5.2 Brazil

11 Middle East & Africa

11.1 Middle East & Africa Wafer Slicing Equipment Market Size and Growth Rate Analysis (2019-2030)

11.2 Middle East & Africa Key Manufacturers Analysis

11.3 Middle East & Africa Wafer Slicing Equipment Market Size by Type

11.3.1 Middle East & Africa Wafer Slicing Equipment Sales by Type (2019-2030)

11.3.2 Middle East & Africa Wafer Slicing Equipment Revenue by Type (2019-2030)

11.4 Middle East & Africa Wafer Slicing Equipment Market Size by Application

11.4.1 Middle East & Africa Wafer Slicing Equipment Sales by Application (2019-2030)

11.4.2 Middle East & Africa Wafer Slicing Equipment Revenue by Application (2019-2030)

11.5 Middle East & Africa Wafer Slicing Equipment Market Size by Country

11.5.1 Saudi Arabia

11.5.2 South Africa

12 Competition by Manufacturers

12.1 Global Wafer Slicing Equipment Market Sales, Revenue and Price by Key Manufacturers (2020-2024)

12.1.1 Global Wafer Slicing Equipment Market Sales by Key Manufacturers (2020-2024)

12.1.2 Global Wafer Slicing Equipment Market Revenue by Key Manufacturers (2020-2024)

12.1.3 Global Wafer Slicing Equipment Average Sales Price by Manufacturers (2020-2024)

12.2 Wafer Slicing Equipment Competitive Landscape Analysis and Market Dynamic

12.2.1 Wafer Slicing Equipment Competitive Landscape Analysis

12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales

12.2.3 Market Dynamic

13 Key Companies Analysis

13.1 DISCO

13.1.1 DISCO Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.1.2 DISCO Wafer Slicing Equipment Product Portfolio

13.1.3 DISCO Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.2 Tokyo Seimitsu

13.2.1 Tokyo Seimitsu Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.2.2 Tokyo Seimitsu Wafer Slicing Equipment Product Portfolio

13.2.3 Tokyo Seimitsu Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.3 GL Tech Co Ltd

13.3.1 GL Tech Co Ltd Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.3.2 GL Tech Co Ltd Wafer Slicing Equipment Product Portfolio

13.3.3 GL Tech Co Ltd Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.4 ASM

13.4.1 ASM Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.4.2 ASM Wafer Slicing Equipment Product Portfolio

13.4.3 ASM Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.5 Synova

13.5.1 Synova Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.5.2 Synova Wafer Slicing Equipment Product Portfolio

13.5.3 Synova Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.6 CETC Electronics Equipment Group Co., Ltd.

13.6.1 CETC Electronics Equipment Group Co., Ltd. Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.6.2 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Product Portfolio

13.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.7 Shenyang Heyan Technology Co., Ltd.

13.7.1 Shenyang Heyan Technology Co., Ltd. Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.7.2 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Product Portfolio

13.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.

13.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Product Portfolio

13.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.9 Hi-TESI

13.9.1 Hi-TESI Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.9.2 Hi-TESI Wafer Slicing Equipment Product Portfolio

13.9.3 Hi-TESI Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

13.10 Tensun

13.10.1 Tensun Basic Company Profile (Employees, Areas Service, Competitors and Contact Information)

13.10.2 Tensun Wafer Slicing Equipment Product Portfolio

13.10.3 Tensun Wafer Slicing Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024)

14 Industry Chain Analysis

14.1 Wafer Slicing Equipment Industry Chain Analysis

14.2 Wafer Slicing Equipment Industry Upstream Supply Analysis

14.2.1 Upstream Key Raw Material Supply Analysis

14.2.2 Raw Material Suppliers and Contact Information

14.3 Wafer Slicing Equipment Typical Downstream Customers

14.4 Wafer Slicing Equipment Sales Channel Analysis

15 Research Findings and Conclusion

16 Methodology and Data Source

16.1 Methodology/Research Approach

16.2 Research Scope

16.3 Benchmarks and Assumptions

16.4 Date Source

16.4.1 Primary Sources

16.4.2 Secondary Sources

16.5 Data Cross Validation

16.6 Disclaimer

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