Research Summary
Wafer thinning equipment refers to machinery and tools used in the process of reducing the thickness of semiconductor wafers to achieve the desired specifications for semiconductor device fabrication. This process, known as wafer thinning or backgrinding, is typically performed after semiconductor devices have been fabricated on the wafer and before the individual chips are separated and packaged. Wafer thinning equipment includes specialized machines such as wafer grinders, chemical mechanical planarization (CMP) systems, and polishing machines. These machines utilize precision grinding wheels, abrasive slurries, or chemical etchants to remove material from the backside of the wafer, gradually reducing its thickness while maintaining uniformity and flatness. Wafer thinning equipment is critical in semiconductor manufacturing, as it enables the production of thinner wafers with precise thickness control, which is essential for achieving high-performance semiconductor devices and increasing the yield of integrated circuits.
According to DIResearch's in-depth investigation and research, the global Wafer Thinning Equipment market size will reach US$ Million in 2024, and is expected to reach US$ Million in 2030, with a CAGR of % (2025-2030). Among them, the China market has changed rapidly in the past few years. The market size in 2024 will be US$ Million, accounting for approximately % of the world. It is expected to reach US$ Million in 2030, and the global share will reach %.
The major global manufacturers of Wafer Thinning Equipment include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, SpeedFam, Hauhaiqingke etc. The global players competition landscape in this report is divided into three tiers. The first tiers is the global leading enterprise, which occupies a major market share, is in a leading position in the industry, has strong competitiveness and influence, and has a large revenue scale; the second tiers has a certain share and popularity in the market, actively follows the industry leaders in product, service or technological innovation, and has a medium revenue scale; the third tiers has a smaller share in the market, has a lower brand awareness, mainly focuses on the local market, and has a relatively small revenue scale.
This report studies the market size, price trends and future development prospects of Wafer Thinning Equipment. Focus on analysing the market share, product portfolio, prices, sales volume, revenue and gross profit margin of global major manufacturers, as well as the market status and trends of different product types and applications in the global Wafer Thinning Equipment market. The report data covers historical data from 2019 to 2023, based year in 2024 and forecast data from 2025 to 2030.
The regions and countries in the report include North America, Europe, China, APAC (excl. China), Latin America and Middle East and Africa, covering the Wafer Thinning Equipment market conditions and future development trends of key regions and countries, combined with industry-related policies and the latest technological developments, analyze the development characteristics of Wafer Thinning Equipment industries in various regions and countries, help companies understand the development characteristics of each region, help companies formulate business strategies, and achieve the ultimate goal of the company's global development strategy. ? ?
The data sources of this report mainly include the National Bureau of Statistics, customs databases, industry associations, corporate financial reports, third-party databases, etc. Among them, macroeconomic data mainly comes from the National Bureau of Statistics, International Economic Research Organization; industry statistical data mainly come from industry associations; company data mainly comes from interviews, public information collection, third-party reliable databases, and price data mainly comes from various markets monitoring database.
Global Key Manufacturers of Wafer Thinning Equipment Include:
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Wafer Thinning Equipment Product Segment Include:
Fully Automatic
Semi-Automatic
Wafer Thinning Equipment Product Application Include:
200mm Wafer
300mm Wafer
Others
Chapter Scope
Chapter 1: Product Research Range, Product Types and Applications, Market Overview, Market Situation and Trends
Chapter 2: Global Wafer Thinning Equipment Industry PESTEL Analysis
Chapter 3: Global Wafer Thinning Equipment Industry Porter's Five Forces Analysis
Chapter 4: Global Wafer Thinning Equipment Major Regional Market Size (Revenue, Sales, Price) and Forecast Analysis
Chapter 5: Global Wafer Thinning Equipment Market Size and Forecast by Type and Application Analysis
Chapter 6: North America Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 7: Europe Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 8: China Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 9: APAC (Excl. China) Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 10: Latin America Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 11: Middle East and Africa Wafer Thinning Equipment Competitive Analysis (Market Size, Key Players and Market Share, Product Type and Application Segment Analysis, Countries Analysis)
Chapter 12: Global Wafer Thinning Equipment Competitive Analysis of Key Manufacturers (Sales, Revenue, Market Share, Price, Regional Distribution and Industry Concentration)
Chapter 13: Key Company Profiles (Product Portfolio, Sales, Revenue, Price and Gross Margin)
Chapter 14: Industrial Chain Analysis, Include Raw Material Suppliers, Distributors and Customers
Chapter 15: Research Findings and Conclusion
Chapter 16: Methodology and Data Sources
Table of Contents 1 Wafer Thinning Equipment Market Overview 1.1 Product Definition and Statistical Scope 1.2 Wafer Thinning Equipment Product by Type 1.2.1 Global Wafer Thinning Equipment Market Size by Type, 2023 VS 2024 VS 2030 1.2.2 Fully Automatic 1.2.3 Semi-Automatic 1.3 Wafer Thinning Equipment Product by Application 1.3.1 Global Wafer Thinning Equipment Market Size by Application, 2023 VS 2024 VS 2030 1.3.2 200mm Wafer 1.3.3 300mm Wafer 1.3.4 Others 1.4 Global Wafer Thinning Equipment Market Revenue and Sales Analysis 1.4.1 Global Wafer Thinning Equipment Market Size Analysis (2019-2030) 1.4.2 Global Wafer Thinning Equipment Market Sales Analysis (2019-2030) 1.4.3 Global Wafer Thinning Equipment Market Sales Price Trend Analysis (2019-2030) 1.5 Wafer Thinning Equipment Market Development Status and Trends 1.5.1 Wafer Thinning Equipment Industry Development Status Analysis 1.5.2 Wafer Thinning Equipment Industry Development Trends Analysis 2 Wafer Thinning Equipment Market PESTEL Analysis 2.1 Political Factors Analysis 2.2 Economic Factors Analysis 2.3 Social Factors Analysis 2.4 Technological Factors Analysis 2.5 Environmental Factors Analysis 2.6 Legal Factors Analysis 3 Wafer Thinning Equipment Market Porter's Five Forces Analysis 3.1 Competitive Rivalry 3.2 Threat of New Entrants 3.3 Bargaining Power of Suppliers 3.4 Bargaining Power of Buyers 3.5 Threat of Substitutes 4 Global Wafer Thinning Equipment Market Analysis by Regions 4.1 Wafer Thinning Equipment Overall Market: 2023 VS 2024 VS 2030 4.2 Global Wafer Thinning Equipment Revenue and Forecast Analysis (2019-2030) 4.2.1 Global Wafer Thinning Equipment Revenue and Market Share by Region (2019-2024) 4.2.2 Global Wafer Thinning Equipment Revenue Forecast by Region (2025-2030) 4.3 Global Wafer Thinning Equipment Sales and Forecast Analysis (2019-2030) 4.3.1 Global Wafer Thinning Equipment Sales and Market Share by Region (2019-2024) 4.3.2 Global Wafer Thinning Equipment Sales Forecast by Region (2025-2030) 4.4 Global Wafer Thinning Equipment Sales Price Trend Analysis (2019-2030) 5 Global Wafer Thinning Equipment Market Size by Type and Application 5.1 Global Wafer Thinning Equipment Market Size by Type 5.1.1 Global Wafer Thinning Equipment Revenue and Forecast Analysis by Type (2019-2030) 5.1.2 Global Wafer Thinning Equipment Sales and Forecast Analysis by Type (2019-2030) 5.2 Global Wafer Thinning Equipment Market Size by Application 5.2.1 Global Wafer Thinning Equipment Revenue and Forecast Analysis by Application (2019-2030) 5.2.2 Global Wafer Thinning Equipment Sales and Forecast Analysis by Application (2019-2030) 6 North America 6.1 North America Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 6.2 North America Key Manufacturers Analysis 6.3 North America Wafer Thinning Equipment Market Size by Type 6.3.1 North America Wafer Thinning Equipment Sales by Type (2019-2030) 6.3.2 North America Wafer Thinning Equipment Revenue by Type (2019-2030) 6.4 North America Wafer Thinning Equipment Market Size by Application 6.4.1 North America Wafer Thinning Equipment Sales by Application (2019-2030) 6.4.2 North America Wafer Thinning Equipment Revenue by Application (2019-2030) 6.5 North America Wafer Thinning Equipment Market Size by Country 6.5.1 US 6.5.2 Canada 7 Europe 7.1 Europe Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 7.2 Europe Key Manufacturers Analysis 7.3 Europe Wafer Thinning Equipment Market Size by Type 7.3.1 Europe Wafer Thinning Equipment Sales by Type (2019-2030) 7.3.2 Europe Wafer Thinning Equipment Revenue by Type (2019-2030) 7.4 Europe Wafer Thinning Equipment Market Size by Application 7.4.1 Europe Wafer Thinning Equipment Sales by Application (2019-2030) 7.4.2 ? Europe Wafer Thinning Equipment Revenue by Application (2019-2030) 7.5 Europe Wafer Thinning Equipment Market Size by Country 7.5.1 Germany 7.5.2 France 7.5.3 United Kingdom 7.5.4 Italy 7.5.5 Spain 7.5.6 Benelux 8 China 8.1 China Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 8.2 China Key Manufacturers Analysis 8.3 China Wafer Thinning Equipment Market Size by Type 8.3.1 China Wafer Thinning Equipment Sales by Type (2019-2030) 8.3.2 China Wafer Thinning Equipment Revenue by Type (2019-2030) 8.4 China Wafer Thinning Equipment Market Size by Application 8.4.1 China Wafer Thinning Equipment Sales by Application (2019-2030) 8.4.2 China Wafer Thinning Equipment Revenue by Application (2019-2030) 9 APAC (excl. China) 9.1 APAC (excl. China) Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 9.2 APAC (excl. China) Key Manufacturers Analysis 9.3 APAC (excl. China) Wafer Thinning Equipment Market Size by Type 9.3.1 APAC (excl. China) Wafer Thinning Equipment Sales by Type (2019-2030) 9.3.2 APAC (excl. China) Wafer Thinning Equipment Revenue by Type (2019-2030) 9.4 APAC (excl. China) Wafer Thinning Equipment Market Size by Application 9.4.1 APAC (excl. China) Wafer Thinning Equipment Sales by Application (2019-2030) 9.4.2 APAC (excl. China) Wafer Thinning Equipment Revenue by Application (2019-2030) 9.5 APAC (excl. China) Wafer Thinning Equipment Market Size by Country 9.5.1 Japan 9.5.2 South Korea 9.5.3 India 9.5.4 Australia 9.5.5 Indonesia 9.5.6 Vietnam 9.5.7 Malaysia 9.5.8 Thailand 10 Latin America 10.1 Latin America Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 10.2 Latin America Key Manufacturers Analysis 10.3 Latin America Wafer Thinning Equipment Market Size by Type 10.3.1 Latin America Wafer Thinning Equipment Sales by Type (2019-2030) 10.3.2 Latin America Wafer Thinning Equipment Revenue by Type (2019-2030) 10.4 Latin America Wafer Thinning Equipment Market Size by Application 10.4.1 Latin America Wafer Thinning Equipment Sales by Application (2019-2030) 10.4.2 Latin America Wafer Thinning Equipment Revenue by Application (2019-2030) 10.5 Latin America Wafer Thinning Equipment Market Size by Country 10.5.1 Mexico 10.5.2 Brazil 11 Middle East & Africa 11.1 Middle East & Africa Wafer Thinning Equipment Market Size and Growth Rate Analysis (2019-2030) 11.2 Middle East & Africa Key Manufacturers Analysis 11.3 Middle East & Africa Wafer Thinning Equipment Market Size by Type 11.3.1 Middle East & Africa Wafer Thinning Equipment Sales by Type (2019-2030) 11.3.2 Middle East & Africa Wafer Thinning Equipment Revenue by Type (2019-2030) 11.4 Middle East & Africa Wafer Thinning Equipment Market Size by Application 11.4.1 Middle East & Africa Wafer Thinning Equipment Sales by Application (2019-2030) 11.4.2 Middle East & Africa Wafer Thinning Equipment Revenue by Application (2019-2030) 11.5 Middle East & Africa Wafer Thinning Equipment Market Size by Country 11.5.1 Saudi Arabia 11.5.2 South Africa 12 Competition by Manufacturers 12.1 Global Wafer Thinning Equipment Market Sales, Revenue and Price by Key Manufacturers (2020-2024) 12.1.1 Global Wafer Thinning Equipment Market Sales by Key Manufacturers (2020-2024) 12.1.2 Global Wafer Thinning Equipment Market Revenue by Key Manufacturers (2020-2024) 12.1.3 Global Wafer Thinning Equipment Average Sales Price by Manufacturers (2020-2024) 12.2 Wafer Thinning Equipment Competitive Landscape Analysis and Market Dynamic 12.2.1 Wafer Thinning Equipment Competitive Landscape Analysis 12.2.2 Global Key Manufacturers Headquarter Location and Key Area Sales 12.2.3 Market Dynamic 13 Key Companies Analysis 13.1 Disco 13.1.1 Disco Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.1.2 Disco Wafer Thinning Equipment Product Portfolio 13.1.3 Disco Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.2 TOKYO SEIMITSU 13.2.1 TOKYO SEIMITSU Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.2.2 TOKYO SEIMITSU Wafer Thinning Equipment Product Portfolio 13.2.3 TOKYO SEIMITSU Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.3 G&N 13.3.1 G&N Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.3.2 G&N Wafer Thinning Equipment Product Portfolio 13.3.3 G&N Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.4 Okamoto Semiconductor Equipment Division 13.4.1 Okamoto Semiconductor Equipment Division Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.4.2 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Product Portfolio 13.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.5 CETC 13.5.1 CETC Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.5.2 CETC Wafer Thinning Equipment Product Portfolio 13.5.3 CETC Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.6 Koyo Machinery 13.6.1 Koyo Machinery Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.6.2 Koyo Machinery Wafer Thinning Equipment Product Portfolio 13.6.3 Koyo Machinery Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.7 Revasum 13.7.1 Revasum Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.7.2 Revasum Wafer Thinning Equipment Product Portfolio 13.7.3 Revasum Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.8 WAIDA MFG 13.8.1 WAIDA MFG Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.8.2 WAIDA MFG Wafer Thinning Equipment Product Portfolio 13.8.3 WAIDA MFG Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.9 Shenzhen Fangda 13.9.1 Shenzhen Fangda Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.9.2 Shenzhen Fangda Wafer Thinning Equipment Product Portfolio 13.9.3 Shenzhen Fangda Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.10 Hunan Yujing Machine Industrial 13.10.1 Hunan Yujing Machine Industrial Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.10.2 Hunan Yujing Machine Industrial Wafer Thinning Equipment Product Portfolio 13.10.3 Hunan Yujing Machine Industrial Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.11 SpeedFam 13.11.1 SpeedFam Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.11.2 SpeedFam Wafer Thinning Equipment Product Portfolio 13.11.3 SpeedFam Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 13.12 Hauhaiqingke 13.12.1 Hauhaiqingke Basic Company Profile (Employees, Areas Service, Competitors and Contact Information) 13.12.2 Hauhaiqingke Wafer Thinning Equipment Product Portfolio 13.12.3 Hauhaiqingke Wafer Thinning Equipment Market Data Analysis (Revenue, Sales, Price, Gross Margin and Market Share) (2020-2024) 14 Industry Chain Analysis 14.1 Wafer Thinning Equipment Industry Chain Analysis 14.2 Wafer Thinning Equipment Industry Upstream Supply Analysis 14.2.1 Upstream Key Raw Material Supply Analysis 14.2.2 Raw Material Suppliers and Contact Information 14.3 Wafer Thinning Equipment Typical Downstream Customers 14.4 Wafer Thinning Equipment Sales Channel Analysis 15 Research Findings and Conclusion 16 Methodology and Data Source 16.1 Methodology/Research Approach 16.2 Research Scope 16.3 Benchmarks and Assumptions 16.4 Date Source 16.4.1 Primary Sources 16.4.2 Secondary Sources 16.5 Data Cross Validation 16.6 Disclaimer
Publisher: DIResearch
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